Danfoss Silicon Power is establishing production in the US and entering into a collaboration with industrial giant General Electric (GE). The collaboration means that Danfoss Silicon Power will become the world´s leading provider of silicon-carbide (SiC) power modules. The SiC power modules will create smaller, faster, and more effective electronic devices, and are expected to revolutionize the technology within solar and wind energy as well as the future generations of electric and hybrid cars.
The transatlantic collaboration between Danfoss and GE will be part of New York Power Electronics Manufacturing Consortium (NY-PEMC) in Utica, upstate New York. The private-public consortium and other similar programs were established in 2014 by the state of New York with a total investment of more than USD 20 billion for the creation of high-tech jobs.
By early 2018, DSP will establish SiC power modules packaging operations in Utica, and is expected to create hundreds of jobs in the coming years. GE will provide SiC chips for the modules.
The news has been announced today, Friday, March 24, by Andrew M. Cuomo, Governor of New York State, which is financing all startup costs as well as production facilities. Danfoss will lease both the facility and equipment from New York State and occupy the entire facility in Utica, which includes two cleanrooms, labs, offices and logistics space.
With 330,000 employees, GE is one of the world´s leading industrial companies. It has spent millions of dollars in developing the ultra-thin SiC chips, which will be used in the power modules from Danfoss. Danfoss Silicon Power, based in Flensburg, in Germany, is part of the Danfoss Group, which has more than 25,000 employees globally. Danfoss Silicon Power is a leading manufacturer of power modules, which are used in a wide range of applications for the industrial, renewable energy and automotive sectors. They have provided power modules for more than 25 million, mainly European cars.
The SiC power modules are the answer to the global demand for smaller, faster end more effective electronic devices. For example, SiC power modules can reduce power consumption in electric cars by 10% and the energy consumption in data centers by 5%, just as they can lower the weight of an airplane by 500 kilos. In the future, the power modules are also expected to be applied in other sectors like shipping, offshore and hospitals.